xMEMS mass-produces solid-state chips for AI cooling

xMEMS Labs has begun mass production of its XMC-2400 and XMC-4800 solid-state cooling chips, targeting AI glasses, smartphones, and data center components. The chips use a vibrating silicon membrane, derived from the company's speaker technology, to move air through narrow channels without any spinning parts. Customers testing the chips reported temperature reductions of 10 to 25 degrees Celsius. The XMC-2400 suits personal SSDs and AI glasses, while the larger XMC-4800 handles thermally demanding smartphones and enterprise SSDs. First commercial products are expected in early 2027, with live demos planned at CES in January.